Lai Gui

Physics meets Finance.
Precision at every level.
LOADING
. . .
Completed
0
All Research

Master Project (PDM) · 2026

Radiation Damage Analysis for Irradiated SiPMs using Emission Microscopy

Period March – July 2026
Affiliation LPHE, EPFL, Switzerland
Supervisors Dr Esteban Currás Rivera · Dr Guido Haefeli
Responsible Professor Prof. Olivier Schneider
Python Signal Processing Peak-Finding Image Analysis 2D Gaussian Fitting NumPy / SciPy Matplotlib

Overview

Silicon Photomultipliers (SiPMs) are the detector of choice in many high-energy physics experiments, including LHCb. In radiation-harsh environments they accumulate damage from high-energy particles, which dramatically increases their dark count rate (DCR) — a noise floor that can eventually overwhelm physics signals. Understanding where inside each microcell that damage sits, and how strongly each defect site contributes to noise, is crucial for developing next-generation radiation-tolerant sensors.

This project applied Emission Microscopy (EMMI) — infrared camera imaging through a microscope — to directly visualise avalanche emission hotspots in both non-irradiated and neutron-irradiated SiPMs from Hamamatsu and FBK. By combining EMMI imaging with IV measurements, I established a device-independent linear relationship between emission intensity and dark current, and developed a 2D Gaussian reconstruction pipeline to extract the amplitude, size, and position of individual radiation damage points within single microcells.


SiPM Mechanism & Infrared Emission

A SiPM is an array of Single-Photon Avalanche Diodes (SPADs), each biased above the breakdown voltage (Vbd). An incoming photon — or a thermally generated carrier — triggers an avalanche in the high-field multiplication region near the silicon surface. The accelerating charge carriers lose energy via Bremsstrahlung, emitting infrared photons in the process. These photons can be captured by a cooled scientific camera mounted on a microscope, giving a direct spatial map of where avalanches are occurring.

Radiation damage (from neutrons or protons) creates trap states in the silicon bulk via Non-Ionising Energy Loss (NIEL). These traps generate electron–hole pairs through Shockley–Read–Hall (SRH) recombination, increasing the DCR and the associated IR emission. The emission intensity is therefore a proxy for local trap density — and for local dark current.

sipm mechanism
Fig. 1 — Cross-section of two SiPM microcells showing the multiplication region (high E-field, orange/red) near the surface, separated by a trench. Charge carriers accelerating through this region emit infrared photons (Bremsstrahlung) that are detectable by an IR camera.

Devices Under Study

Two SiPM technologies were studied across four neutron fluence levels plus a non-irradiated reference, giving ten samples in total.

Hamamatsu H2024 (50 µm pitch)

NamePixel SizeFluence (neq/cm²)Vbd ch118
H202450 µm1×10¹³51.69 ± 0.02 V
H202450 µm3×10¹²50.97 ± 0.02 V
H202450 µm1×10¹²51.45 ± 0.07 V
H202450 µm3×10¹¹51.31 ± 0.02 V
H202450 µm0 (reference)51.10 ± 0.11 V

FBK W3m / W1m (31 µm pitch)

NamePixel SizeFluence (neq/cm²)Vbd ch118
W3m31 µm1×10¹³31.07 ± 0.02 V
W3m31 µm3×10¹²31.00 ± 0.02 V
W3m31 µm1×10¹²31.11 ± 0.02 V
W3m31 µm3×10¹¹31.19 ± 0.02 V
W1m31 µm0 (reference)30.94 ± 0.04 V

The Vbd values show minimal systematic shift with fluence for both technologies, confirming that bulk damage does not significantly alter the junction doping balance at these fluence levels.

sipm hamamatsu photo sipm fbk photo
Fig. 2 — Microscope photographs of the Hamamatsu H2024 (left) and FBK W3m (right) SiPM chips used in this study. The 50 µm and 31 µm microcell grids are visible.

Emission Microscopy (EMMI) Technique

EMMI works by imaging the IR photons spontaneously emitted by avalanching microcells. A cooled scientific camera is mounted on a microscope above the biased SiPM. Two images are taken:

  • Reference image — taken under visible-light illumination to provide a structural map of the microcell grid.
  • Emission image — taken in complete darkness with the SiPM biased at a chosen over-voltage (OV = Vbias − Vbd), typically for a 10-minute exposure to accumulate sufficient photon statistics.

The two images are then co-registered and overlaid, with the emission intensity rendered as a false-colour heat map on top of the structural reference.

emmi reference emmi raw emission
Fig. 3 — Reference image (left) and raw emission image (right) from a single EMMI acquisition. The emission strip corresponds to the active area of the SiPM.
emmi superimposed
Fig. 4 — Superimposed EMMI image. The yellow-orange heat map shows the emission intensity from avalanching microcells, aligned to the reference structure. A −0.80° rotation was applied to correct for camera tilt relative to the SiPM grid.

IV Scan Results

Before EMMI acquisition, each sample was characterised with a current–voltage (IV) scan. The dark current above breakdown — directly proportional to DCR — scales systematically with neutron fluence for both technologies.

iv scan hamamatsu iv scan fbk
Fig. 5 — Dark current vs. over-voltage for Hamamatsu (left) and FBK (right) SiPMs across all fluence levels. The current at a fixed over-voltage scales approximately linearly with fluence, consistent with the NIEL damage constant framework.

Camera Noise Subtraction

For non-irradiated SiPMs the emission signal is extremely faint — typically <200 ADU/px above background — making camera noise the dominant contribution. A dedicated dark image is taken under identical conditions (10-minute exposure, same temperature, SiPM unbiased). This dark frame is pixel-wise subtracted from the emission image before analysis, revealing the true photon emission structure.

noise subtraction
Fig. 6 — Raw emission image (top) at 6.0 OV for a non-irradiated SiPM showing camera noise dominating. After dark-frame subtraction (bottom), the actual emission strip becomes visible at a signal level of ~175 ADU/px.

Non-Irradiated SiPMs: Defect Localisation

Even in pristine, unirradiated SiPMs, EMMI reveals discrete bright hotspots at high over-voltages. These spots are reproducible, device-specific, and grow in brightness but not in number as OV is increased from 1.0 V to 10.0 V.

non irradiated ov series
Fig. 7 — EMMI images at increasing over-voltage (1.0 to 10.0 V) for the non-irradiated Hamamatsu SiPM. Isolated hotspots emerge at ~4.0 OV and grow brighter at 8.0–10.0 OV, while the overall grid background remains dark.
non irradiated 10ov ch118
Fig. 8 — EMMI at 10.0 OV for H2024_50um_0neq ch118. The column-level zooms reveal that bright hotspots consistently appear at or near the boundaries between microcells (trench walls), not at cell centres.

This pattern was observed consistently across multiple channels (ch101, ch102, ch117, ch118) and in the FBK W1m device at 12.0 OV. The hotspots always appear at, or very close to, the inter-cell trench walls. While this behaviour has been noted qualitatively in prior EMMI literature (Acerbi et al., Sensors 2021; Spatially-resolved DCR, Eur. Phys. J. C 2018), no clear mechanism has been established. Three candidate explanations are:

  1. Etch-induced crystal damage: The deep reactive-ion etching (DRIE) used to form trench isolation creates lattice damage at trench walls, leaving permanently active trap states.
  2. Field leakage at high OV: At elevated bias, the trench dielectric is no longer fully effective at isolating the electric field between adjacent cells, creating enhanced-field volumes at the trench wall.
  3. Field line crowding at trench corners: The abrupt geometry at trench walls concentrates field lines, producing locally amplified electric field that triggers enhanced avalanche activity.

Importantly, this phenomenon is a property of the manufacturing process, not of radiation damage. It sets a lower-bound noise floor that persists even in radiation-naive devices.


Irradiated SiPMs: Emission vs. Fluence

In irradiated devices the emission character changes fundamentally. Instead of isolated hotspots, every cell glows — the active area fills uniformly with emission that brightens rapidly as OV increases above breakdown. At 3.0 OV the cells are already near saturation and the emission intensity across all 160 visible cells follows a near-Gaussian distribution.

irradiated ov series
Fig. 9 — EMMI for 1×10¹² neq/cm² Hamamatsu at successive over-voltages. Individual cells begin lighting at 1.5 OV; by 3.0 OV the entire active area is saturated with emission. The averaged cell (inset) shows a smooth, centre-peaked profile consistent with the SiPM's cylindrical high-field region.
cell distribution
Fig. 10 — Distribution of per-cell average emission intensity across all 160 cells at 3.0 OV for 1×10¹² neq/cm². The approximately Gaussian shape indicates that radiation damage is statistically uniform across cells, with cell-to-cell variation driven by Poisson fluctuations in the number of damage points per cell.

Emission Intensity ∝ Dark Current

A key physics question is whether the total optical emission from a cell is simply proportional to its dark current, or whether the relationship depends on fluence, bias, or device technology. To test this, the mean emission intensity of the active channel was plotted against the simultaneously measured dark current for each bias point and each fluence level.

emission vs ov and current emission vs current all
Fig. 11 — Top: emission intensity vs. OV and vs. dark current for the 1×10¹² neq/cm² sample individually. Bottom: the same plot with all five fluences overlaid — all data points collapse onto a single universal linear relationship, independent of fluence and bias.

Key finding: The emission intensity is strictly proportional to dark current regardless of neutron fluence. This confirms that EMMI is a faithful spatial proxy for DCR across the full range of radiation damage studied — from unirradiated to 1×10¹³ neq/cm².

The physical interpretation is straightforward: each SRH generation event (whether from a manufacturing defect or a radiation-induced trap) produces one avalanche, which in turn emits a fixed average number of IR photons. The proportionality constant (~57 ADU/px per µA in the active channel) reflects the camera sensitivity and the collection geometry, not the device physics. The single universal line spanning all fluences rules out any significant fluence-dependence of the per-avalanche photon yield.


Damage Point Analysis via Gaussian Reconstruction

At low to moderate over-voltages in irradiated FBK SiPMs, individual cells show discrete bright spots — localised emission peaks corresponding to single damage clusters. To extract quantitative information about each damage point (amplitude, spatial sigma, x–y position), a two-stage algorithm was developed:

  1. Peak finding: A brightness mask (top 50% of pixel values) isolates candidate regions; connected-component labelling then finds peaks with an area threshold of ≥40 px to suppress noise spikes.
  2. 2D Gaussian reconstruction: Each identified peak is fit with a 2D elliptical Gaussian to extract amplitude, centroid (x, y), and widths (σx, σy). The sum of all Gaussians is compared against the original image as a validation step.
damage point analysis
Fig. 12 — Damage point analysis pipeline for a single irradiated FBK microcell at 2.0 OV. Eight emission peaks are identified (bottom-left), and their 2D Gaussian reconstruction (bottom-right) reproduces the original image with ~94% of the total integrated intensity.
gaussian reconstruction grid
Fig. 13 — Side-by-side comparison of original EMMI (left) and Gaussian reconstruction (right) across 64 FBK microcells at 2.0 OV. The reconstruction recovers 7.368×10⁸ ADU out of 7.826×10⁸ ADU (94.1%), demonstrating good fidelity across cells with varying numbers of damage points.

The Gaussian parameters (amplitude, sigma, position) for each identified damage point are then catalogued across all cells and bias voltages. This enables spatial statistics on damage point density, comparison between fluence levels, and — in future work — correlation with specific neutron track signatures from Monte Carlo simulations.


Summary

Universal emission–current proportionality: Emission intensity ∝ dark current, independent of fluence (0 to 1×10¹³ neq/cm²) and bias. EMMI is a direct spatial probe of DCR.

Trench-wall hotspots in non-irradiated SiPMs: Bright, stable emission spots appear at microcell boundaries at high OV, likely caused by manufacturing-induced crystal defects or enhanced local electric fields at trench walls. This sets a noise floor independent of radiation dose.

Damage point reconstruction: The 2D Gaussian pipeline successfully identifies and characterises individual radiation damage points within single microcells, opening a route to per-cell damage statistics and comparison with neutron transport simulations.

This work forms part of a broader effort at LPHE, EPFL to understand and mitigate radiation damage in SiPMs destined for the LHCb Upgrade II VELO and SciFi detectors, which will operate at luminosities up to 1.5×10³⁴ cm⁻² s⁻¹.



All Research